Mini/micro soldering and wire wrapping / Murray P. Rosenthal.

By:

Material type: Text

TextPublication details: Rochelle Park, N.J. : Hayden Book Co., c1978.Description: 112 p. ; 21 cmISBN:

Subject(s):

DDC classification:

LOC classification:

Tags from this library: No tags from this library for this title. Log in to add tags.

Average rating: 0.0 (0 votes)

Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Books	Raman Research Institute Library	621.38-77 ROS (Browse shelf(Opens below))	Available		11166

Previous			No cover image available		No cover image available		No cover image available	Next
Previous	621.38-77 JOW Reliable electronic assembly production,	621.38-77 LAU Modern solder technology for competitive electronics manufacturing	621.38-77 LAU "Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies"	621.38-77 ROS Mini/micro soldering and wire wrapping /	621.38-77 VIL Electronic techniques - shop practices and construction	621.38-77 WHE Electronic assembly and fabrication /	621.38-772 ARE Technical equipment catalog E 34	Next

Includes index.

There are no comments on this title.

to post a comment.

Raman Research Institute Library OPAC